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Bismaleimide / ABRON (BR 720 FR) is an bismaleimide based resin composition which is useful for the manufacture of FR4 grade printed circuit boards which would meet the UL-94 test of flammability. ABRON BR 720 FR can be used to prepare laminates for the electronics industry by the standard techniques used in the field. The resin, ABRON BR 720 FR, is dissolved in an solvent and then used to impregnate fabric (glass, silica, etc) and then dried at an elevated temperature to form a prepreg. The prepregs so obtained may be laminated with copper foil under pressure and temperature. These laminates can be used in fabrication of printed circuit boards having improved properties (Low dielectric constant, improved toughness and excellent thermal resistance).
SPECIFICATIONS OF ABRON BR720FR
| APPEARANCE |
YELLOW FINE POWDER |
| BULK DENSITY |
0.6 - 0.8 gm/cc |
| INHERENT VISCOSITY |
0.3 - 0.5 dl/gm |
SOLUBILITY
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SOLUBLE IN NMP/DMF/DMAc |
| CURE TEMPERATURE |
180°C |
| SERVICE TEMPERATURE |
250 - 300°C |
| SHELF LIFE |
12 - 18 MONTHS WHEN STORED IN CLOSED CONTAINERS |
| RESIN CURE TIME |
4 - 5 MIN AT 180°C |
| PRESS CYCLE TIME |
2 - 3 HRS AT 180°C |
| POST CURING |
12 - 16 HRS AT 230 - 250°C |
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